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Responsibilities:

• Lead and contribute directly, working on design and analysis of signal integrity and electromagnetic effects in highly complex high frequency, high dynamic range mixed signal systems in an innovative research and development environment.
• Perform analytical studies of electronic systems (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, etc.) to support design tradeoffs.
• Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI), packaging parasitic estimation.
• Lead associated design, testing and verification efforts to ensure measured results meet desired design targets, and to continually improve simulation-measurement correlation.
• Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art.
• Create new design strategies where possible to support functional requirements while meeting SI, PI and EM goals.
• Deep understanding of RF/EMC measurement and analysis (s-parameters, eigenmodes, TDR, FFT, IF, etc.)
• Work closely with other domain experts performing related functional analyses (e.g. packaging design and analysis, circuit design, thermal/mechanical analysis, etc.).

 

Required Education:

• Bachelors degree with 5 plus years experience with a wide range of CAD/simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity); 3 years with a Masters' degree; 0 years with a PhD.
• More than 4 years experience with high frequency measurement techniques (VNA, TDR) for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.

-OR-

• Bachelors degree with 9 plus years experience with a wide range of CAD/simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity); 7 years with a Masters' degree; 4 years with a PhD.
• More than 4 years experience with high frequency measurement techniques (VNA, TDR) for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.

Required Skills:

• Understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques.
• Knowledge of fundamental electrical engineering and circuit design principles.
• Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.

 

Desired Skills:

• Experience with spectrum and network analyzer techniques for EMC measurements.
• Experience with high speed oscilloscopes (both real-time and sampling) and other time domain instruments (e.g. BERT) for analog and digital signal characterization.
• Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) is a plus.
• Familiarity with cryogenic test stands, superconductivity, mechanical CTE, is a plus.
• Ability to work well in a team and independently, to adapt to changing priorities and requirements, ask questions, make recommendations, document current processes and propose value add changes.